AI in Semiconductors

The chip race isn’t about smaller transistors anymore — it’s about how you package them. According to Expertlancing Research Services LLP, 2.5D and 3D IC packaging is projected to exceed $160 billion by 2035, outpacing traditional process-node advances. This shift means performance is now defined by system-level integration, not just die size. The real innovation lies in how chiplets, memory, and interconnects are combined. What does this mean for AI hardware roadmaps? The physical layer of AI is evolving beyond the fab — it’s becoming a design challenge. This insight is drawn from the article: 'Advanced Semiconductor Packaging: Winning the New Chip Race' — https://expertlancing.com/advanced-semiconductor-packaging-new-chip-race/ Source: https://expertlancing.com/advanced-semiconductor-packaging-new-chip-race/ View and join any or all of our communities — AI, quantum, and real estate: https://alex-companies.com/reports/linkedin-groups If there's an AI, quantum, or real estate community you'd like to see us convene, tell us — this portfolio grows by request. MIT, Nvidia, Google & IBM-Trained. Cross Domain-Expert: Quantum, AI, Ethics, Sovereignty, Intelligence, Philanthropy. Solepoint Planning. VUI AI Cloud Architect. AI Certifications Development. Quant/AI Instructor. Castor Venture Club Member. Associate Broker. George Arnold Alexander III, MPA Director, ALEX Companies Associate Broker, Alexander Tiffany Southwest, LLC dba ALEX.realestate, et.al. Texas License #574878-B · Broker License #565194-BB Broker, ALEX Real Estate · North Carolina License #367733 Independent Broker, ALEX Real Estate · Colorado License #II.100112456 [email protected] · +1 713.918.9951